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What Are The Requirements For Stencil Fabrication Of Circuit Boards

Jan 21, 2019

PCB assembly stencil is a special die in the process of printed circuit board, its main function is to help the deposition of solder paste, the purpose is to transfer the exact amount of solder paste to the exact position on the empty PCB, PCB stencil has an important role, will directly affect the quality of assembly.Therefore, there are strict standards for the fabrication and acceptance of steel mesh.Next, the FASTPCBA technician arranges the manufacturing requirements of the circuit board stencil.


steel mesh

I. requirements for stencil making for PCB assembly:

1. Suppliers shall make stencil according to relevant documents and materials provided by engineering department.

2. Steel mesh shall be marked with product model, thickness, production date, etc.

3. The frame size of the stencil shall be 550MM*650MM 370MM*470MM, etc., mainly based on the structure of the printing machine and the product specifications.

4, the thickness of the steel mesh (scraping generally in 0.18mm-0.2mm MMM, scraping tin 0.1mm-0.15mm).

5, steel mesh opening and opening size (tin beads generally open V, U, concave, etc., the specific to the type of each component.)

6. The incoming direction and the SMT machine shall be unified.