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Reliability Analysis Of Lead-free Solder Joints

Jan 10, 2019

With the rapid development of the electronic information industry, the fine pitch devices have developed and the assembly density has become higher and higher. New SMT and MCM technologies have been born, and the solder joints in microelectronic devices are getting smaller and smaller, and the mechanics and electricity they carry. And the thermodynamic load is getting heavier and heavier, and the reliability requirements are increasing. SMT packaging technology widely used in electronic packaging and new chip size package (CSP), solder ball array (BGA) and other packaging technologies require direct electrical and rigid mechanical connections between the materials (mainly subjected to shear strain) through solder joints. Its quality and reliability determine the quality of electronic products.


The failure of a solder joint may cause the overall failure of the device, so how to ensure the quality of the solder joint is an important issue. Traditional lead-tin solders contain lead, while lead and lead compounds are highly toxic substances. Long-term use of lead-containing solders can cause serious harm to human health and the living environment.


At present, the demand for lead-free soldering in the electronics industry is becoming more and more urgent, which has already had a huge impact on the entire industry. Lead-free solders have begun to gradually replace leaded solders, but lead-free technology is indispensable to bring new problems to solder joint reliability due to solder differences and adjustments in soldering process parameters. Therefore, the reliability of lead-free solder joints has also received increasing attention.